System DESIGN – FLOOR FINISHES
LevelDek can accommodate different substrates, meaning that a wide variety of floor finishes can be catered for. The raised nature of the system allows for the easy installation of services before the cradles and battens are positioned. If the grid dimensions of the cradles are carefully considered before being finalised all the initial services can be installed prior to the LevelDek system being laid.
LD-01 is the basic construction suggested for mid-range projects where chipboard is regarded as an acceptable substrate to floor finishes. With a thermal conductivity of 0.14 W/mK, chipboard is suitable for projects with relatively low heat demands as the thermal resistances of further finishes such as engineered timber, carpet etc. have to be added and therefore taken into consideration.
LD-02 using a 18mm ply is considered the preferred substrate. Despite having a thermal conductivity of 0.17 W/mK ply is historically preferred within the industry.
LD-03 is the construction specifically for tile. stone and terrazzo floor finishes. Using the proven ceramic Screed Replacement Tile as the substrate for notoriously fickle floor finishes. Recognised by the Stone Federation Of Great Britain this solution is offered with a 5 year warranty against floor failure. This construction requires no decoupling mat and all finishes can be installed directly using a standard class C2/S1 adhesive. Any format stone and tile acceptable.